1
of
2
Loading...
Tin 0.8mm 50g 99,3%Sn 0,7%Cu GOOBAY 77422
New
Bezolovnatý pájecí cín - průměr 0,8 mm, hmotnost 50 g, složení Sn99/Ag0,3/Cu0,7, jádro z kalafunového tavidla (no-clean, bez nutnosti čištění spoje), bez halogenů, nízké emise kouře, snížené rozstřikování, max. teplota pájení 450°C, vhodný pro SMD, DIP, desky plošných spojů, kabely a spotřební elektroniku
In stock 5 pcs
Expected shipping:
15.06.2026
Regular price
239,00 Kč
197,52 Kč
excl. VAT
Unit price
/
Unavailable
GOOBAY | SKU:
06550480
Tin 0.8mm 50g 99,3%Sn 0,7%Cu GOOBAY 77422
Regular price
239,00 Kč
197,52 Kč
excl. VAT
Unit price
/
Unavailable
Product description
In full swing: The narrow diameter makes tin easy to dispense and ideal for precision work, e.g. for soldering electrical components and devices such as circuit boards, SMDs, DIPs, cables, TVs, headphones or microphones. The integrated cleaning-free flux is particularly convenient as it does not need to be removed from the joint after soldering.
Soldering wire filled with flux with a diameter of 0.8 mm, ideal for e.g. soldering electronics
Simple and homogeneous wetting of the solder joint thanks to the rosin flux core
Cleaning-free solution with continuous flux cores that do not require cleaning of the solder joint after use
Reduced spatter for increased user safety and workpiece protection
Halogen-free and low smoke emissions
Ideal for soft soldering at low temperatures up to 450°C in automated and manual soldering applications
Technical specifications:
Composition: 0.3% silver, 0.7% copper, 99% tin.
Flux content: 2,5
Melting point: 217 °C
Soldering wire filled with flux with a diameter of 0.8 mm, ideal for e.g. soldering electronics
Simple and homogeneous wetting of the solder joint thanks to the rosin flux core
Cleaning-free solution with continuous flux cores that do not require cleaning of the solder joint after use
Reduced spatter for increased user safety and workpiece protection
Halogen-free and low smoke emissions
Ideal for soft soldering at low temperatures up to 450°C in automated and manual soldering applications
Technical specifications:
Composition: 0.3% silver, 0.7% copper, 99% tin.
Flux content: 2,5
Melting point: 217 °C
