Tin 1.0mm 17g 99,3%Sn 0,7%Cu GOOBAY 40843
Recommended
Bezolovnatý pájecí cín - průměr 1,0 mm, hmotnost 17 g, složení Sn99 / Ag0,3 / Cu0,7, obsah tavidlového jádra 2,5 %, no-clean kalafunové tavidlo bez nutnosti čištění spoje, bez halogenů, nízké emise kouře, snížené rozstřikování, vhodný pro SMD, DIP, desky plošných spojů, kabely a spotřební elektroniku
In stock more than 5 pcs
Expected shipping:
15.06.2026
Regular price
115,00 Kč
95,04 Kč
excl. VAT
Unit price
/
Unavailable
GOOBAY | SKU:
06550476
Product description
Suitable for soldering electrical components and devices such as printed circuit boards, printed circuit boards, SMD, DIP, cables, televisions, headphones or microphones. The flux is already incorporated into the tin for particularly easy and effective soldering.
Flux-cored solder wire with a thin diameter of 1.0 mm for particularly easy dosing and soldering of fine components
Easy, homogeneous wetting of the solder joint thanks to the rosin core
No-clean solution with continuous flow cores that saves cleaning of the solder joint after use
Reduced spatter for increased user safety and workpiece protection
Halogen-free and with low smoke emissions
Ideal for soft soldering at low temperatures in the area of ??automated and manual soldering
Technical parameters:
Content: 0.3% silver, 0.7% copper, 99% tin, flux core content: 2.5%, melting point 217°C
Weight: 17g
Flux-cored solder wire with a thin diameter of 1.0 mm for particularly easy dosing and soldering of fine components
Easy, homogeneous wetting of the solder joint thanks to the rosin core
No-clean solution with continuous flow cores that saves cleaning of the solder joint after use
Reduced spatter for increased user safety and workpiece protection
Halogen-free and with low smoke emissions
Ideal for soft soldering at low temperatures in the area of ??automated and manual soldering
Technical parameters:
Content: 0.3% silver, 0.7% copper, 99% tin, flux core content: 2.5%, melting point 217°C
Weight: 17g
