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Flux Gel 1,4cm3 AG CHEMIA AGT-047
Recommended
Flux gel tavidlo - třída RMA, objem 1,4 cm3, zahuštěné kalafunové tavidlo, technologie No-clean (nevyžaduje mytí po pájení), připraveno pro tisk po dobu 36 hodin, zachovává lepivost 72 hodin, vhodné pro montáž a opravy SMT prvků (BGA, SOP, PLCC, SMD), aplikace sítí, šablonou nebo stříkačkou, optimální pájitelnost na površích Ag, Cu, Au, Zn, Cd a SnPb
In stock more than 5 pcs
Expected shipping:
15.06.2026
Regular price
115,00 Kč
95,04 Kč
excl. VAT
Unit price
/
Unavailable
OEM | SKU:
06560557
Flux Gel 1,4cm3 AG CHEMIA AGT-047
Regular price
115,00 Kč
95,04 Kč
excl. VAT
Unit price
/
Unavailable
Product description
Flux / Flux gel 1.4cm3 AG Chemia
Flux / gel is a concentrated rosin flux of RMA class, designed for installation and repair of SMT elements (BGA, SOP, PLCC, SMD)
The flux / gel can be applied via a sieve, a template or from a syringe.
The activators used for the production of the flux make it possible to leave its residues after soldering (if the process does not involve a washing phase).
Best solderability on surfaces: Ag, Cu, Au, Zn, Cd and SnPb
Properties
Does not require washing after soldering ,, No-clean ,,
Ready to print: 36 hours
Retains tack for up to 72 hours
Specifications
Package content 1.4cm3
Manufacturer AG Thermopasts
Flux / gel is a concentrated rosin flux of RMA class, designed for installation and repair of SMT elements (BGA, SOP, PLCC, SMD)
The flux / gel can be applied via a sieve, a template or from a syringe.
The activators used for the production of the flux make it possible to leave its residues after soldering (if the process does not involve a washing phase).
Best solderability on surfaces: Ag, Cu, Au, Zn, Cd and SnPb
Properties
Does not require washing after soldering ,, No-clean ,,
Ready to print: 36 hours
Retains tack for up to 72 hours
Specifications
Package content 1.4cm3
Manufacturer AG Thermopasts
